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High Performance Rolled Annealed Copper Foil , Thin Copper Foil for Laminating

High Performance Rolled Annealed Copper Foil , Thin Copper Foil for Laminating

    • High Performance Rolled Annealed Copper Foil  ,  Thin Copper Foil for Laminating
  • High Performance Rolled Annealed Copper Foil  ,  Thin Copper Foil for Laminating

    Product Details:

    Place of Origin: China
    Brand Name: Civen Brand
    Certification: ROHS / CTI
    Model Number: MGP-TR021005

    Payment & Shipping Terms:

    Minimum Order Quantity: 1000 KG
    Price: $ 5.0 - 50.0 / KG
    Packaging Details: 3 inch steel core & Strong wooden box
    Delivery Time: 10 To 15 Days
    Supply Ability: 137500 KG Per Week
    Contact Now
    Detailed Product Description
    Material: Red Copper Shape: Roll
    Application: Laminating Temper: Annealed
    Specification: To Be Customized Price: To Be Negotiated
    Grade: A
    High Light:

    pure copper foil

    ,

    rolled copper foil

    FCCL Front -  End Material ,  Copper Foil With High Performance 

     

     

    Application : 

     

    1. It can be used for the HDI dry or wet film before treatedment
    2.  the solder green oil before treatment 

    Advantange :

    1. Copper surface are can be increased and can improe the fry or wet green oil film 's adhesion with copper foil. 
    2. Also it can supports the Anti-peeling of the solder oil when producing HDI circuit board through the mathod of chemical shen tin, chemical nickel gold and so on. 

    Features:

    1. The material has higher extensibility,
    2.  Has a high bending resistance 
    3.  No crack.

     

     

    Raw Material

    Name

    GB

    ALLOY NO.

    SIZE (mm)

    (ISO)

    (ASMT)

    (JIS)

    (BIS)

    (DIN)

    Copper Foil

    T2

    Cu-ETP

    C11000

    C1100

    C101

    R-Cu57

    Thickness: 0.006-0.1 /Max Width: 650

     

     

    FPC T2 high flex rolled copper foil properties (IPC-6542)

    Item

    Unit

    Parameters

    12μm

    18μm

    25μm

    35μm

    70μm

    Mass per unit(±5%)

    g/m²

    105

    160

    300

    400

    445

    Cu+Ag

    %

    ≥99.99

    Temper

     

    H

    O,H

    O,H

    O,H

    O,H

    Surface roughness

    Ra

    μm

      0.13              

    0.12

    0.1

    0.08

     0.08

    Rz

    μm

    1.3

    1.0

    0.8

    0.74

    0.76

    Tensile strength

    Normal Temp /23℃

    N/mm²

    ≥430

    ≥450

    ≥450

    ≥450

    ≥450

    High Temp /220℃

    N/mm²

    ≥140

    ≥150

    ≥170

    ≥210

    ≥220

    Elongation

    Normal Temp /23℃

    %

    ≥1.5

    ≥3.0

    ≥4.0

    ≥4.2

    ≥4.5

    High Temp /220℃

    %

    ≥8

    ≥10

    ≥18

    ≥28

    ≥30

    Fatigue Resistance (annealed)

    %

    65

    65

    65

    65

    65

    Maximum resistivity

    Ωmm2/m

    0.0181

    Electrical conductivity

    %

    ≥98.3%

    Film and adhesive layers

    Instant Temp.

     300℃/10s

    Film and adhesive paste after transient

     temperature without blistering delamination.

    Anti oxidation 

    H.T.(200℃)

    Minute

    Won’t Change the Color within 60 minutes

    Pinhole test results

    piece/ m²

    Pinhole area more than 0.5 mm²,0.005 piece/ m²

    Note:

     1.  Above figures based on the material with 0.05mm in thickness and 600mm in width.

      2.  Normally, Copper, cobalt and nickel is coated on the rough surface.

     

    SEM PICTURE : 

     

    High Performance Rolled Annealed Copper Foil  ,  Thin Copper Foil for Laminating 0

     

    PACKING CONDITION : 

     

    High Performance Rolled Annealed Copper Foil  ,  Thin Copper Foil for Laminating 1

     

    Contact Details
    Civen Metal Material(Shanghai) Co.,Ltd

    Contact Person: Mr. Duearwin Moon

    Send your inquiry directly to us (0 / 3000)

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