|Place of Origin:||CHINA|
|Minimum Order Quantity:||1 MT|
|Packaging Details:||WOODEN CASE PACKING|
|Delivery Time:||1 MONTH|
|Supply Ability:||550 MT PER MONTH|
|Product Name:||Tin Coated Copper||Type:||RA, Plated , Not Alloy|
|Shape:||Coil||Width:||According To Customer's Requirement|
|Thickness:||According To Customer's Requirement||Customer:||Samsung , LG|
Advanced Tin Plating - Tinned Copper Alloy With Tin Coated Outside Anti - Oxidizing
The tin-plating process is used extensively to protect both ferrous and nonferrous surfaces. Tin is a useful metal for the food processing industry since it is non-toxic, ductile and corrosion resistant. The excellent ductility of tin allows a tin coated base metal sheet to be formed into a variety of shapes without damage to the surface tin layer. It provides sacrificial protection for copper, nickel and other non-ferrous metals, but not for steel.
Tin is also widely used in the electronics industry because of its ability to protect the base metal from oxidation thus preserving its solderability. In electronic applications, 3% to 7% lead may be added to improve solderability and to prevent the growth of metallic "whiskers" in compression stressed deposits, which would otherwise cause electrical shorting. However, RoHS (Restriction of Hazardous Substances) regulations enacted beginning in 2006 require that no lead be added intentionally and that the maximum percentage not exceed 1%. Some exemptions have been issued to RoHS requirements in critical electronics applications due to failures which are known to have occurred as a result of tin whisker formation.
Advanced Plating Technologies can underplate tin electrodeposits with copper plating or nickel plating to enhance solderability and improve durability of the tin deposit in high temperature applications (reference: How do I make a solderable deposit or What type of tin plating should I use for my application in our Plating Topics section). A nickel or copper underplate prior to tin plating will minimize migration of alloying metals such as zinc from the substrate into the tin deposit in applications such as switchgear, terminal spades or fuse caps. For critical defense or aerospace applications, codeposited lead – commonly referred to as solder deposits – can be provided to enhance wetting during soldering and minimize the potential for whisker growth.
Surface Treatment :
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