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Large Dimension Electrodeposited Copper Foil fOR EMI / EMC Shielding

Large Dimension Electrodeposited Copper Foil fOR EMI / EMC Shielding

    • Large Dimension Electrodeposited Copper Foil fOR EMI / EMC Shielding
    • Large Dimension Electrodeposited Copper Foil fOR EMI / EMC Shielding
  • Large Dimension Electrodeposited Copper Foil fOR EMI / EMC Shielding

    Product Details:

    Place of Origin: SHANGHAI,CHINA
    Brand Name: Civen
    Certification: ISO/ROHS/CTI/SGS

    Payment & Shipping Terms:

    Minimum Order Quantity: 1000kg
    Price: Negotiation
    Packaging Details: Packed in strong wooden case suit for exporting
    Delivery Time: 15~20 days after receiving your deposit
    Payment Terms: L/C, T/T
    Supply Ability: 1200MT Per Month
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    Detailed Product Description
    Product Name: Large Dimension ED Copper Foils For Shielding Alloy Number: C11000
    Thickness: 1/4OZ~3OZ(9μm~105μm) Width: 1290mm
    Density: 8.9g/cm3 Ra Value: ≤0.43
    Rz Value: ≤3.5 Application: EMI Or EMC For Shielding

    Large Dimension ED Copper Foils For Shielding With Maximum Width Of 1290mm

     

     

    Specification:

     

    We can manufacture the thickness range from 9µm~105µm foils based on customer’s demands. Compared to RA copper foil, most people use ED copper foil to do shielding because of the dimension. As we know Civen can produce the maximum width of ED copper foil at 1290mm, which can meet customer’s demands for the large area more better. Also production for ED foil is fast and efficient.

     

    Performance:

     

    Classification

    Unit

    9μm

    12μm

    18μm

    35μm

    50μm

    70μm

    105μm

    Cu Content

    %

    ≥99.8

    Area Weigth

    g/m2

    80±3

    107±3

    153±5

    283±7

    440±8

    585±10

    875±15

    Tensile Strength

    R.T.(23℃)

    Kg/mm2

    ≥28

    H.T.(180℃)

    ≥15

    ≥18

    ≥20

    Elongation

    R.T.(23℃)

    %

    ≥5.0

    ≥6.0

    ≥10

    H.T.(180℃)

    ≥6.0

    ≥8.0

    Roughness

    Shiny(Ra)

    μm

    ≤0.43

    Matte(Rz)

    ≤3.5

    Peel Strength

    R.T.(23℃)

    Kg/cm

    ≥0.77

    ≥0.8

    ≥0.9

    ≥1.0

    ≥1.0

    ≥1.5

    ≥2.0

    Degraded rate of HCΦ(18%-1hr/25℃)

    %

    ≤7.0

    Change of color(E-1.0hr/200℃)

    %

    Good

    Solder Floating 290℃

    Sec.

    ≥20

    Appearance(Spot and copper powder)

    ----

    None

    Pinhole

    EA

    Zero

    Size Tolerance

    Width

    0~2mm

    0~2mm

    Length

    ----

    ----

    Core

    Mm/inch

    Inside Diameter 79mm/3 inch                                             

     

    Product Photo
     
    Large Dimension Electrodeposited Copper Foil fOR EMI / EMC Shielding

     

    Factory Show

     

    Large Dimension Electrodeposited Copper Foil fOR EMI / EMC Shielding

     

    Why Choose us Civen as your supplier?


    1. Good reputation in Cu fields.
    2. Full Experience on cooperatrate with the world's leading large enterprises, such as Samsung, BYD
    3. With certificate ISO,ROHS,CTI and SGS.
    4. Delivery on time.
    5. Perfect quality of the goods wuth all the mill certificate.
    6. Good communication skill,good service for understanding your requirements.
    7. Strong sea-worthy package.

    Contact Details
    Civen Metal Material(Shanghai) Co.,Ltd

    Contact Person: Mr. Duearwin Moon

    Send your inquiry directly to us (0 / 3000)

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