Home ProductsRA Copper Foil

0.018mm * 520mm Single RA Copper Foil / Cu Foil Roll For FCCL With Japanese Technology

0.018mm * 520mm Single RA Copper Foil / Cu Foil Roll For FCCL With Japanese Technology

0.018mm * 520mm Single RA Copper Foil / Cu Foil Roll For FCCL With Japanese Technology

Product Details:

Place of Origin: SHANGHAI, CHINA
Brand Name: Civen
Certification: ROHS / IOS 9001 /CTI CERTIFICATION
Model Number: MGP-TR021009

Payment & Shipping Terms:

Minimum Order Quantity: 1000 kg
Price: USD 5 - 50 per KG
Packaging Details: Strong Wooden Case
Delivery Time: 10 - 15 working days
Payment Terms: L/C, T/T
Supply Ability: 550 Ton per Month
Contact Now
Detailed Product Description
Product Name: High Precision RA Copper Foil Material: Imported Copper Ingots
Process: Rolling Appearance: Gray & Shiny
Certificate: ROHS / CE / TS Alloy Number: C1100
Markets: Korea , Japan

0.018mm * 520mm Single Side Shiny RA Cu Foil For FCCL With Japanese Technology

 

 

Description : 

 

  •  Civen RA Copper Foil is rolled from pure copper ingots, the process including purifying copper ores,  make into copper cathodes,  ingoting,  rolling, annealing, washing, testing, slitting and packing.
  •  Our copper ores are imported from South America, which were famous for their copper mining.
  •  This is high quality copper and has a wide range of applications based on conductivity, corrosion resistance, workability, and beauty.
  •  110-anneal (Electrolytic Tough Pitch or ETP) dead soft. Min 99.96% CU

Applications:

 

  1.  Flexible Copper Clad Laminate(FCCL)
  2.  Fine Circuit FPC
  3.  LED coated crystal thin film.

Advantange :

 

  1. Copper surface are can be increased and can improe the fry or wet green oil film 's adhesion with copper foil. 
  2.  it can supports the Anti-peeling of the solder oil when making HDI board by the mathod of chemical shen tin, chemical nickel gold and etc. 

 

Mechanical Properties :

 

Item

Unit

Parameters

12μm

18μm

25μm

35μm

70μm

Mass per unit(±5%)

g/m²

105

160

300

400

445

Cu+Ag

%

≥99.99

Temper

 

H

O,H

O,H

O,H

O,H

Surface roughness

Ra

μm

  0.13              

0.12

0.1

0.08

 0.08

Rz

μm

1.3

1.0

0.8

0.74

0.76

Tensile strength

Normal Temp /23℃

N/mm²

≥430

≥450

≥450

≥450

≥450

High Temp /220℃

N/mm²

≥140

≥150

≥170

≥210

≥220

Elongation

Normal Temp /23℃

%

≥1.5

≥3.0

≥4.0

≥4.2

≥4.5

High Temp /220℃

%

≥8

≥10

≥18

≥28

≥30

Fatigue Resistance (annealed)

%

65

65

65

65

65

Maximum resistivity

Ωmm2/m

0.0181

Electrical conductivity

%

≥98.3%

Film and adhesive layers

Instant Temp.

300℃/10s

Film and adhesive paste after transient 

temperature without blistering delamination.

Anti oxidation 

H.T.(200℃)

Minute

Won’t Change the Color within 60 minutes

Pinhole test results

piece/ m²

Pinhole area more than 0.5 mm²,0.005 piece/ m²

 

Application Show : 

 

0.018mm * 520mm Single RA Copper Foil / Cu Foil Roll For FCCL With Japanese Technology

Our Packing Condition :

 

0.018mm * 520mm Single RA Copper Foil / Cu Foil Roll For FCCL With Japanese Technology

 

Contact Details
Civen Metal Material(Shanghai) Co.,Ltd

Contact Person: Mr. Duearwin Moon

Send your inquiry directly to us (0 / 3000)

Other Products