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High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate

High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate

    • High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate
    • High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate
  • High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate

    Product Details:

    Place of Origin: SHANGHAI,CHINA
    Brand Name: Civen
    Certification: ISO/ROHS/CTI/SGS

    Payment & Shipping Terms:

    Minimum Order Quantity: 1000kg
    Price: Negotiation
    Packaging Details: Packed in strong wooden case suit for exporting
    Delivery Time: 15~20 working days after receiving your deposit
    Payment Terms: L/C, T/T
    Supply Ability: 1200MT Per Month
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    Detailed Product Description
    Product Name: Single Shiny ED Red Copper Foil For FPC , Maximum Width 600mm Alloy Number: C11000
    Material: Red Copper Shape: Roll Size
    Density: 8.9g/cm3 Thickness: 1/4OZ~1OZ(9μm~35μm)
    Width: 250mm~1295mm Application: FPC
    HS Code: 7410110000 Core: Inside Diameter 79mm/3 Inch

    Single Shiny ED Red Copper Foil For FPC , Maximum Width 600mm

     

     

    Specification:

     

    Thickness: 9µm~35µm

    Width:250mm~1295mm

     

    Performances:

     

    The product surface is black or red, has lower surface roughness.

     

    Applications:

     

    Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

    Features:
    High density, high bending resistance and good etching performance.

     

    Microstructure:

     

    High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate

     

    Table1- Performance:

     

    Classification

    Unit

    9μm

    12μm

    18μm

    35μm

    Cu Content

    %

    ≥99.8

    Area Weigth

    g/m2

    80±3

    107±3

    153±5

    283±7

    Tensile Strength

    R.T.(23℃)

    Kg/mm2

    ≥28

    H.T.(180℃)

    ≥15

    ≥15

    ≥15

    ≥18

    Elongation

    R.T.(23℃)

    %

    ≥5.0

    ≥5.0

    ≥6.0

    ≥10

    H.T.(180℃)

    ≥6.0

    ≥6.0

    ≥8.0

    ≥8.0

    Roughness

    Shiny(Ra)

    μm

    ≤0.43

    Matte(Rz)

    ≤2.5

    Peel Strength

    R.T.(23℃)

    Kg/cm

    ≥0.77

    ≥0.8

    ≥0.8

    ≥0.8

    Degraded rate of HCΦ(18%-1hr/25℃)

    %

    ≤7.0

    Change of color(E-1.0hr/200℃)

    %

    Good

    Solder Floating 290℃

    Sec.

    ≥20

    Appearance(Spot and copper powder)

    ----

    None

    Pinhole

    EA

    Zero

    Size Tolerance

    Width

    mm

    0~2mm

    Length

    mm

    ----

    Core

    Mm/inch

    Inside Diameter 79mm/3 inch

     

    Product Photo

     

    High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate

     

    Application

     

    High bending resistance PCB Copper Foil for Flexible Copper Clad Laminate

     

    Why Choose us Civen as your supplier?

     

    1) One-stop service: PCB fabrication, PCB Assembly, testing;

    2) Reasonable price: perfect cost control ability & price strategy;

    3) Reliable quality:material of high quality, high production efficiency&technology, all-sided strict quality inspection ;

    4) Environment-friendly product: material have SGS report and comply with the ROHS;

    5) Delivery just-in-time;

    6) Independent Quick Turn process.

    7) Small Orders Accepted;

    8) Good after-sales service.

    Contact Details
    Civen Metal Material(Shanghai) Co.,Ltd

    Contact Person: Mr. Duearwin Moon

    Send your inquiry directly to us (0 / 3000)

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