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High Performance Rolled Annealed Copper Foil , Thin Copper Foil for Laminating

High Performance Rolled Annealed Copper Foil , Thin Copper Foil for Laminating

High Performance Rolled Annealed Copper Foil  ,  Thin Copper Foil for Laminating

Product Details:

Place of Origin: China
Brand Name: Civen Brand
Certification: ROHS / CTI
Model Number: MGP-TR021005

Payment & Shipping Terms:

Minimum Order Quantity: 1000 KG
Price: $ 5.0 - 50.0 / KG
Packaging Details: 3 inch steel core & Strong wooden box
Delivery Time: 10 To 15 Days
Supply Ability: 137500 KG Per Week
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Detailed Product Description
Material: Red Copper Shape: Roll
Application: Laminating Temper: Annealed
Specification: To Be Customized Price: To Be Negotiated
Grade: A

FCCL Front -  End Material ,  Copper Foil With High Performance 

 

 

Application : 

 

  1. It can be used for the HDI dry or wet film before treatedment
  2.  the solder green oil before treatment 

Advantange :

  1. Copper surface are can be increased and can improe the fry or wet green oil film 's adhesion with copper foil. 
  2. Also it can supports the Anti-peeling of the solder oil when producing HDI circuit board through the mathod of chemical shen tin, chemical nickel gold and so on. 

Features:

  1. The material has higher extensibility,
  2.  Has a high bending resistance 
  3.  No crack.

 

 

Raw Material

Name

GB

ALLOY NO.

SIZE (mm)

(ISO)

(ASMT)

(JIS)

(BIS)

(DIN)

Copper Foil

T2

Cu-ETP

C11000

C1100

C101

R-Cu57

Thickness: 0.006-0.1 /Max Width: 650

 

 

FPC T2 high flex rolled copper foil properties (IPC-6542)

Item

Unit

Parameters

12μm

18μm

25μm

35μm

70μm

Mass per unit(±5%)

g/m²

105

160

300

400

445

Cu+Ag

%

≥99.99

Temper

 

H

O,H

O,H

O,H

O,H

Surface roughness

Ra

μm

  0.13              

0.12

0.1

0.08

 0.08

Rz

μm

1.3

1.0

0.8

0.74

0.76

Tensile strength

Normal Temp /23℃

N/mm²

≥430

≥450

≥450

≥450

≥450

High Temp /220℃

N/mm²

≥140

≥150

≥170

≥210

≥220

Elongation

Normal Temp /23℃

%

≥1.5

≥3.0

≥4.0

≥4.2

≥4.5

High Temp /220℃

%

≥8

≥10

≥18

≥28

≥30

Fatigue Resistance (annealed)

%

65

65

65

65

65

Maximum resistivity

Ωmm2/m

0.0181

Electrical conductivity

%

≥98.3%

Film and adhesive layers

Instant Temp.

 300℃/10s

Film and adhesive paste after transient

 temperature without blistering delamination.

Anti oxidation 

H.T.(200℃)

Minute

Won’t Change the Color within 60 minutes

Pinhole test results

piece/ m²

Pinhole area more than 0.5 mm²,0.005 piece/ m²

Note:

 1.  Above figures based on the material with 0.05mm in thickness and 600mm in width.

  2.  Normally, Copper, cobalt and nickel is coated on the rough surface.

 

SEM PICTURE : 

 

High Performance Rolled Annealed Copper Foil  ,  Thin Copper Foil for Laminating

 

PACKING CONDITION : 

 

High Performance Rolled Annealed Copper Foil  ,  Thin Copper Foil for Laminating

 

Contact Details
Civen Metal Material(Shanghai) Co.,Ltd

Contact Person: Mr. Duearwin Moon

Send your inquiry directly to us (0 / 3000)

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