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FPC Front - End Material High Precision RA Copper Foil for Printed Circuit Board

FPC Front - End Material High Precision RA Copper Foil for Printed Circuit Board

FPC Front - End Material High Precision RA Copper Foil for Printed Circuit Board

Product Details:

Place of Origin: Shanghai , China
Brand Name: Civen
Certification: ISO - ROHS - SGS - CTI
Model Number: MGP-TR021004

Payment & Shipping Terms:

Minimum Order Quantity: 1000kg
Price: USD 5.0 - 48.0 Per Kilogram
Packaging Details: Wooden Case
Delivery Time: 10 - 15 Days
Payment Terms: L/C, T/T
Supply Ability: 550000 KG / Month
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Detailed Product Description
Material: Copper Purity: Cu + Ag ≥ 99.99%
Color: With One Shiny Side & One Gray Treated Side Application: Adhesive Tape . Flexible Printed Circuit Board
Surface Consistency: Good Width: ≤ 600 Mm ( About 24 Inch )
Temper: Annealed And Treated

 

Treatment Rolling Copper  Foil Used In FCCL Has High Elongation

 

 

Applications:

 

(1) Flexible Copper Clad Laminate(FCCL)

(2) Fine Circuit FPC

(3) LED coated crystal thin film.

(4) Adhesion Tape 

(5) Anti -  Peel devices and so on

 

Normal Specification:

 

(1) Thickness: 0.012mm / 0.018mm / 0.035mm

(2) Width: 260mm / 520mm and so on .

 

Performances:

 

(1) High flexibility and extensibility

(2) Even and smooth surface

(3) Good fatigue resistance

(4) Strong antioxidant properties

(5) Good mechanical properties

(6) The material has higher extensibility

(7) It has a high bending resistance 

(8) It has no crack.

 

Table 1 :

 

Name

GB

ALLOY NO.

SIZE (mm)

(ISO)

(ASMT)

(JIS)

(BIS)

(DIN)

Copper Foil

T2

Cu-ETP

C11000

C1100

C101

R-Cu57

Thickness: 0.006-0.1 /Max Width: 650

 

Table 2 :

 

Item

Unit

Parameters

12μm

18μm

25μm

35μm

70μm

Mass per unit(±5%)

g/m²

105

160

300

400

445

Cu+Ag

%

≥99.99

Temper

 

H

O,H

O,H

O,H

O,H

Surface roughness

Ra

μm

  0.13              

0.12

0.1

0.08

 0.08

Rz

μm

1.3

1.0

0.8

0.74

0.76

Tensile strength

Normal Temp /23℃

N/mm²

≥430

≥450

≥450

≥450

≥450

High Temp /220℃

N/mm²

≥140

≥150

≥170

≥210

≥220

Elongation

Normal Temp /23℃

%

≥1.5

≥3.0

≥4.0

≥4.2

≥4.5

High Temp /220℃

%

≥8

≥10

≥18

≥28

≥30

Fatigue Resistance (annealed)

%

65

65

65

65

65

Maximum resistivity

Ωmm2/m

0.0181

Electrical conductivity

%

≥98.3%

Film and adhesive layers

Instant Temp. 

300℃/10s

Film and adhesive paste after transient 

temperature without blistering delamination.

Anti oxidation 

H.T.(200℃)

Minute

Won’t Change the Color within 60 minutes

Pinhole test results

piece/ m²

Pinhole area more than 0.5 mm²,0.005 piece/ m²

 

Note: 

 1.   Above figures based on the material with 0.05mm in thickness and 600mm in width.

 2.  Normally, Copper, cobalt and nickel is coated on the rough surface.

 3.  Testing method follows our company standard.

 

Table 3 :

 

FPC Front - End Material High Precision RA Copper Foil for Printed Circuit Board

 

Application and Performance : 

 

FPC Front - End Material High Precision RA Copper Foil for Printed Circuit Board

Contact Details
Civen Metal Material(Shanghai) Co.,Ltd

Contact Person: Mr. Duearwin Moon

Send your inquiry directly to us (0 / 3000)

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