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Roll Size S - HTE Electrolytic Copper Foil For PCB Made Of Red Copper

Roll Size S - HTE Electrolytic Copper Foil For PCB Made Of Red Copper

    • Roll Size S - HTE Electrolytic Copper Foil For PCB  Made Of Red Copper
    • Roll Size S - HTE Electrolytic Copper Foil For PCB  Made Of Red Copper
  • Roll Size S - HTE Electrolytic Copper Foil For PCB  Made Of Red Copper

    Product Details:

    Place of Origin: SHANGHAI,CHINA
    Brand Name: Civen
    Certification: ISO SGS
    Model Number: MGP-SH091303

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 MT
    Price: Negotiation
    Packaging Details: stronge wooden cases suit for export with good quality
    Delivery Time: 15~20 days
    Payment Terms: T/T
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    Detailed Product Description
    Alloy Number: C11000 Material: Red Copper
    Shape: Roll Size Thickness: 1/4OZ~20OZ(9μm~70μm)
    Width: 550mm~1295mm Density: 8.9g/cm3
    Application: PCB HS Code: 7410110000

    Roll Size S - HTE  Electrolytic Copper Foil For PCB  Made Of Red Copper

     

    Description:


    CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).Ordinary thickness of the ED copper foils are 6 microns and 8 microns ,12 microns ,18 microns,35microns ,105 microns, 400 microns,etc. The maximum width of the ED copper foil iw 1370mm(53.93inch),.Also we can do special process according to customer requirements .

     

    Specification:

     

    Classification

    Unit

    1/4OZ

    (9μm)

    1/3OZ

    (12μm)

    J OZ

    (15μm)

    1/2OZ

    (18μm)

    1OZ

    (35μm)

    2OZ

    (70μm)

    Cu Content

    %

    ≥99.8

    Area Weigth

    g/m2

    80±3

    107±3

    127±4

    153±5

    283±5

    585±10

    Tensile Strength

    R.T.(25℃)

    Kg/mm2

    ≥28

    ≥30

    H.T.(180℃)

    ≥15

    Elongation

    R.T.(25℃)

    %

    ≥4.0

    ≥5.0

    ≥6.0

    ≥10

    H.T.(180℃)

    ≥4.0

    ≥5.0

    ≥6.0

    Roughness

    Shiny(Ra)

    μm

    ≤0.4

    Matte(Rz)

    ≤5.0

    ≤6.0

    ≤7.0

    ≤7.0

    ≤9.0

    ≤14

    Peel Strength

    R.T.(23℃)

    Kg/cm

    ≥1.0

    ≥1.2

    ≥1.2

    ≥1.3

    ≥1.8

    ≥2.0

    Degraded rate of HCΦ(18%-1hr/25℃)

    %

    ≤5.0

    Change of color(E-1.0hr/190℃)

    %

    Good

    Solder Floating 290℃

    Sec.

    ≥20

    Pinhole

    EA

    Zero

    Preperg

    ----

    FR-4

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

    Metallographic:

    Roll Size S - HTE Electrolytic Copper Foil For PCB  Made Of Red Copper

     

    Contact Details
    Civen Metal Material(Shanghai) Co.,Ltd

    Contact Person: Mr. Duearwin Moon

    Send your inquiry directly to us (0 / 3000)

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